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 Features
* E2 Programmable 524,288 x 1 and 1,048,576 x 1 bit Serial Memories Designed To Store
Configuration Programs For Field Programmable Gate Arrays (FPGA)
* Simple Interface to SRAM FPGAs * Compatible With Atmel AT6000, AT40K FPGAs, Altera EPF8K, EPF10K, * * * * * * * *
EPF6K FPGAs, ORCA FPGAs, Xilinx XC3000, XC4000, XC5200 FPGAs, Motorola MPA1000 FPGAs Cascadable To Support Additional Configurations or Future Higher-density Arrays Low-power CMOS EEPROM Process Programmable Reset Polarity Available In PLCC Package (Pin Compatable across Product Family) In-System Programmable Via 2-Wire Bus Emulation of 24CXX Serial EPROMs Available in 3.3V 10% LV and 5V Versions System Friendly READY Pin
Description
The AT17C512/010 and AT17LV512/010 (high-density AT17 Series) FPGA Configuration EEPROMs (Configurators) provide an easy-to-use, cost-effective configuration memory for Field Programmable Gate Arrays. The high-density AT17 Series is packaged in the popular 20-pin PLCC. The high-density AT17 Series family uses a simple serial-access procedure to configure one or more FPGA devices. The high-density AT17 Series organization supplies enough memory to configure one or multiple smaller FPGAs. The user can select the polarity of the reset function by programming one EEPROM byte. The devices also support a write protection mode and a system friendly READY pin, which signifies a "good" power level to the device and can be used to ensure reliable system power-up. The high-density AT17 Series can be programmed with industry-standard programmers, and the Atmel ATDH2200 Programming board.
FPGA Configuration E2PROM Memory
512K and 1M
AT17C512 AT17LV512 AT17C010 AT17LV010
Pin Configurations
20-Pin PLCC
N C D A T A N C V C C N C
3
CLK WP1 RESET/OE WP2 CE
2
1
20
4 5 6 7 8 9
N C
19 18 17 16 15 14 13
N C
NC SER_EN NC R E A DY CEO
10
G N D
11
N C
12
N C
Rev. 0944A-A-12/97
1
Controlling The High-Density AT17 Series Serial EEPROMs
Most connections between the FPGA device and the Serial EEPROM are simple and self-explanatory: * The DATA output of the high-density AT17 Series drives DIN of the FPGA devices. * The master FPGA CCLK output drives the CLK input of the high-density AT17 Series. * The CEO output of any AT17C/LV512/010 drives the CE input of the next AT17C/LV512/010 in a cascade chain of PROMs. * SER_EN must be connected to VCC, (except during ISP). READY is available as an open-collector indicator of the device's RESET status; it is driven Low while the device is in its POWER-ON RESET cycle and released (tri-stated) when the cycle is complete. There are two different ways to use the inputs CE and OE, as shown in the AC Characteristics waveforms. its simplicity, however, this method will fail if the FPGA receives an external reset condition during the configuration cycle. If a system reset is applied to the FPGA, it will abort the original configuration and then reset itself for a new configuration, as intended. Of course, the high-density AT17 Series does not see the external reset signal and will not reset its internal address counters and, consequently, will remain out of sync with the FPGA for the remainder of the configuration cycle.
Condition 2
The FPGA D/P output drives only the CE input of the highdensity AT17 Series, while its OE input is driven by the inversion of the input to the FPGA RESET input pin. This connection works under all normal circumstances, even when the user aborts a configuration before D/P has gone High. A High lev el on the RES ET/OE inpu t to the AT17C/LVxxx - during FPGA reset - clears the Configurator's internal address pointer, so that the reconfiguration starts at the beginning. The high-density AT17 Series does not require an inverter since the RESET polarity is programmable.
Condition 1
The simplest connection is to have the FPGA D/P output drive both CE and RESET/OE in parallel (Figure 1). Due to
Block Diagram
2
AT17C/LV512/010
AT17C/LV512/010
Pin Configurations
20 PLCC 2 4 5 6 Name DATA CLK WP1 RESET/OE I/O I/O I I I Description Three-state DATA output for reading. Input/Output pin for programming. Clock input. Used to increment the internal address and bit counter for reading and programming. WRITE PROTECT (1). Used to protect portions of memory during programming. See programming guide for details. RESET/Output Enable input (when SER_EN is High). A Low level on both the CE and RESET/OE inputs enables the data output driver. A High level on RESET/OE resets both the address and bit counters. The logic polarity of this input is programmable as either RESET/OE or RESET/OE. This document describes the pin as RESET/OE. WRITE PROTECT (2). Used to protect portions of memory during programming. See programming guide for details. Chip Enable input. Used for device selection. A Low level on both CE and OE enables the data output driver. A High level on CE disables both the address and bit counters and forces the device into a low power mode. Note this pin will not enable/disable the device in 2-wire Serial Programming mode (i.e., when SER_EN is Low). Ground pin. O Chip Enable Out output. This signal is asserted Low on the clock cycle following the last bit read from the memory. It will stay Low as long as CE and OE are both Low. It will then follow CE until OE goes High. Thereafter, CEO will stay High until the entire PROM is read again and senses the status of RESET polarity. Device selection input, A2. This is used to enable (or select) the device during programming, when SER_EN is Low (see Programming Guide for more details) Open collector reset state indicator. Driven Low during power-up reset, released when powerup is complete. (Recommend a 4.7K Pull-up on this pin if used). Serial enable is normally high during FPGA loading operations. Bringing SER_EN Low, enables the two wire serial interface mode for programming. +3.3V/+5V power supply pin.
7 8
WP2 CE
I I
10 14
GND CEO
A2 15 17 20 READY SER_EN VCC
I O I
Absolute Maximum Ratings*
Operating Temperature .................................. -55C to +125C Storage Temperature ..................................... -65C to +150C Voltage on Any Pin with Respect to Ground ............................ -0.1V to VCC + 0.5V Supply Voltage (VCC) .........................................-0.5V to +7.0V Maximum Soldering Temp. (10 s @ 1/16 in.)..................260C ESD (RZAP = 1.5K, CZAP = 100 pF)............................... 2000V *NOTICE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
3
FPGA Master Serial Mode Summary
The I/O and logic functions of the FPGA and their associated interconnections are established by a configuration program. The program is loaded either automatically upon power up, or on command, depending on the state of the three FPGA mode pins. In Master Mode, the FPGA automatically loads the configuration program from an external memory. The Serial Configuration EEPROM has been designed for compatibility with the Master Serial Mode.
After configuration is complete, the address counters of all cascaded Configurators are reset if the reset signal drives the RESET/OE on each Configurator to its active (High) level. If the address counters are not to be reset upon completion, then the RESET/OE inputs can be tied to ground. For more details, please reference the AT17C Series Programming Guide.
Programming Mode Cascading Serial Configuration EEPROMs
For multiple FPGAs configured as a daisy-chain, or for future FPGAs requiring larger configuration memories, cascaded Configurators provide additional memory. As the last bit from the first Configurator is read, the clock signal to the Configurator asserts its CEO output Low and disables its DATA line. The second Configurator recognizes the Low level on its CE input and enables its DATA output. Figure 1. Condition 1 Connection The programming mode is entered by bringing SER_EN Low. In this mode the chip can be programmed by the 2wire interface. The programming is done at V CC supply only. Programming super voltages are generated inside the chip. See the Programming Specification for Atmel's Configuration Memories Application Note for further information. The AT17C Series parts are read/write at 5V nominal. The AT17LV parts are read/write at 3.3V nominal.
AT17C/LVXXX Reset Polarity
The AT17C/LVXXX lets the user choose the reset polarity as either RESET/OE or RESET/OE.
Standby Mode
The AT17C/LVXXX enters a low-power standby mode whenever CE is asserted High. In this mode, the Configurator consumes less than 0.5mA at 5.0 volts. The output remains in a high impedance state regardless of the state of the OE input.
Operating Conditions
AT17CXXX Symbol Description Commercial VCC Industrial Military Supply voltage relative to GND -0C to +70C Supply voltage relative to GND -40C to +85C Supply voltage relative to GND -55C to +125C Min/Max 4.75 / 5.25 4.5 / 5.5 4.5 / 5.5 AT17LVXXX Min/Max 3.0 / 3.6 3.0 / 3.6 3.0 / 3.6 Units V V V
4
AT17C/LV512/010
AT17C/LV512/010
DC Characteristics
VCC = 5V 5% Commercial / 5V 10% Ind./Mil.
Symbol VIH VIL VOH VOL VOH VOL VOH VOL ICCA IL ICCS Description High-level input voltage Low-level input voltage High-level output voltage (IOH = -4 mA) Low-level output voltage (IOL = +4 mA) High-level output voltage (IOH = -4 mA) Low-level output voltage (IOL = +4 mA) High-level output voltage (IOH = -4 mA) Low-level output voltage (IOL = +4 mA) Supply current, active mode (at FMAX) Input or output leakage current (VIN = VCC or GND) Commercial Supply current, standby mode Industrial/Military 0.5 mA -10 3.7 Military 0.4 10 10 0.5 V mA A mA 3.76 Industrial 0.37 V V Commercial 0.32 V V Min 2.0 0 3.86 Max VCC 0.8 Units V V V
DC Characteristics
VCC = 3.3V 10%
Symbol VIH VIL VOH VOL VOH VOL VOH VOL ICCA IL ICCS Description High-level input voltage Low-level input voltage High-level output voltage (IOH = -2.5 mA) Low-level output voltage (IOL = +3 mA) High-level output voltage (IOH = -2 mA) Low-level output voltage (IOL = +3 mA) High-level output voltage (IOH = -2 mA) Low-level output voltage (IOL = +2.5 mA) Supply current, active mode Input or output leakage current (VIN = VCC or GND) Commercial Supply current, standby mode Industrial/Military 100 -10 2.4 Military 0.4 5 10 100 V mA A A A 2.4 Industrial 0.4 V V Commercial 0.4 V V Min 2.0 0 2.4 Max VCC 0.8 Units V V V
5
AC Characteristics
AC Characteristics When Cascading
6
AT17C/LV512/010
AT17C/LV512/010
.
AC Characteristics for AT17C512/010
VCC = 5V 5% Commercial / VCC = 5V 10% Ind./Mil
Commercial/Industrial Symbol TOE
(2)
Military Min Max 35 45 50 0 Units ns ns ns ns 50 20 20 25 0 20 15 ns ns ns ns ns ns MHz 2.2 V
Description OE to Data Delay CE to Data Delay CLK to Data Delay Data Hold From CE, OE, or CLK CE or OE to Data Float Delay CLK Low Time CLK High Time CE Setup Time to CLK (to guarantee proper counting) CE Hold Time to CLK (to guarantee proper counting) OE High Time (Guarantees Counter Is Reset) MAX Input Clock Frequency Ready Pin Open Collector Voltage
Min
Max 30 45 50
TCE(2) TCAC(2) TOH TDF TLC THC TSCE THCE THOE FMAX VRDY
(2) (3)
0 50 20 20 20 0 20 15 1.2 2.2
1.2
AC Characteristics for AT17C512/010 When Cascading
VCC = 5V 5% Commercial / VCC = 5V 10% Ind./Mil.
Commercial/Industrial Symbol TCDF
(3)
Military Min Max 50 40 35 30 Units ns ns ns ns
Description CLK to Data Float Delay CLK to CEO Delay CE to CEO Delay
Min
Max 50 35 35 30
TOCK(2) TOCE(2)
(2)
TOOE RESET/OE to CEO Delay Notes: 1. Preliminary specifications for military operating range only. 2. AC test load = 50 pF.
3. Float delays are measured with 5 pF AC loads. Transition is measured 200 mV from steady state active levels.
7
AC Characteristics for AT17LV512/010
VCC = 3.3V 10%
Commercial/Industrial Symbol TOE(2) TCE(2) TCAC(2) TOH TDF(3) TLC THC TSCE THCE THOE FMAX VRDY Notes:
(4)
Military
Description OE to Data Delay CE to Data Delay CLK to Data Delay Data Hold From CE, OE, or CLK CE or OE to Data Float Delay CLK Low Time CLK High Time CE Setup Time to CLK (to guarantee proper counting) CE Hold Time to CLK (to guarantee proper counting) OE High Time (Guarantees Counter Is Reset) MAX Input Clock Frequency
Min
Max
50 55 55
Min
Max
55 60 60
Units ns ns ns ns
0 50 25 25 30 0 25 15 1.2 2.2
0 50 25 25 35 0 25 10 1.2 2.2
ns ns ns ns ns ns MHz V
Ready Pin Open Collector Voltage 1. Preliminary specifications for military operating range only. 2. AC test load = 50 pF.
3. Float delays are measured with 5 pF AC loads. Transition is measured 200 mV from steady state active levels. 4. During cascade FMAX = 12.5 MHz.
AC Characteristics for AT17LV512/010 When Cascading
VCC = 3.3V 10%
Commercial/Industrial Symbol TCDF
(3) (2)
Military Min Max 50 55 40 35 Units ns ns ns ns
Description CLK to Data Float Delay CLK to CEO Delay CE to CEO Delay RESET/OE to CEO Delay
Min
Max 50 50 35 35
TOCK
TOCE(2) TOOE(2)
8
AT17C/LV512/010
AT17C/LV512/010
Ordering Information - 5V Devices
Memory Size 512K Ordering Code AT17C512-10JC AT17C512-10JI 1M AT17C010-10JC AT17C010-10JI Package 20J 20J 20J 20J Operation Range Commercial (0C to 70C) Industrial (-40C to 85C) Commercial (0C to 70C) Industrial (-40C to 85C)
Ordering Information - 3.3V Devices
Memory Size 512K Ordering Code AT17LV512-10JC AT17LV512-10JI 1M AT17LV010-10JC AT17LV010-10JI Package 20J 20J 20J 20J Operation Range Commercial (0C to 70C) Industrial (-40C to 85C) Commercial (0C to 70C) Industrial (-40C to 85C)
Package Type 20J 20 Lead, Plastic J-Leaded Chip Carrier (PLCC)
9


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